HFCL has strengthened its IO product portfolio of Wireless Solutions with the roll-out of Wi-Fi 6 products in addition to their existing Wi-Fi 5 Access Points (APs). This new range of IO products by HFCLis targeted to serve global Carriers, Enterprises and Internet Service Providers to provide seamless data connectivity to their consumers.
The perpetually growing demand for higher speeds, increasing density of connected devices and diverse applications have strained the wireless access networks to their limits. This critical challenge gets addressed by Wi-Fi 6 which is based on the IEEE 802.11ax standards. Wi-Fi 6 is capable of delivering >2 times the capacity & at 75% lower latency as compared to Wi-Fi 5 products.
Furthermore, the Wi-Fi 6 products are compatible and complementary to the upcoming 5G technology, offering a seamless integration with 5G core, enabling a smooth mobile data offload implementation for operators thereby providing lower latency & increased capacity over their predecessors without any hassles of a complex Wi-Fi – 3GPP core integration. Together they bring next-level, seamless functionality to the wireless world.
HFCL IO networks new product range consists of Wi-Fi 6 (802.11ax) Dual Band Outdoor & Indoor Access Points, and Telco Grade Cloud NMS support for comprehensive security features like WPA3, IEEE 802.1X and IEEE 802.11i to ensure higher encryption & secure data transfer of numerous, simultaneously connected devices. This latest range offers an ultimate solution for outdoor hotspots where high speed connectivity and security of data are the most important need of users who want to remain connected.
The new dual band Wi-Fi 6 Access Points are ideal for dense deployment including large enterprises, office buildings, retail outlets, malls, schools, stadiums, hospitals and many other areas. These APs showcase Wi-Fi Alliance Certified EasyMesh* support that can automatically create self-organizing, self-healing network interoperating even with third party APs with zero touch provisioning, making it very simple and easy to install and configure. Based on the Wi-Fi 6 standard, these APs deliver higher capacity, enhanced power efficiency, and best in class performance even in densely populated or congested environments.
HFCL has closely worked with Qualcomm Technologies Inc. as the platform provider for enhancing its Wi-Fi portfolio. Based on Qualcomm® Networking Pro Series platform, IO solutions are designed to provide effective connectivity in complex surroundings and ensuring secure data transfer. All these products are manufactured in India and with world-class quality.
Mr. Mahendra Nahata, Managing Director, HFCL Limited, said, “Our new product line of Wi-Fi 6 products strengthens our mission to deliver customer excellence through continuous innovation. The association with Qualcomm Technologies has really been an exciting journey and together we plan to deliver more robust, efficient, and scalable solutions. Our entire product portfolio has been conceptualized, designed, developed and manufactured in India while complying with all relevant global standards. We call it Make-in-India for the World.”
Mr. Rajen Vagadia, Vice President Qualcomm Global & President, Qualcomm India Private Limited said, “Wi-Fi 6 is a transformational re-imagination of how Wi-Fi works as it is designed to accommodate the ever-growing number of connected devices. The Qualcomm Networking Pro Series platforms raise the bar for managing the surge in connected devices, handling the variation and complexity of those devices, data needs and improving the quality of the overall connectivity experiences they deliver, all with increased security. Qualcomm Technologies is happy to join hands with HFCL for development of their Wi-Fi 6 portfolio of products for their IO brand. We look forward to bringing the benefits of latest technology, greater capacity and network efficiencies of Wi-Fi 6 to HFCL’s customers and end users across India and the world.”